Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method

	Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method
	Kai Yu ; Fan Yang ; Hui Cong ; Lin Zhou ; Qingyun Liu ; Lichun Zhang ; Buwen Cheng ; Chunlai Xue ; Yuhua Zuo ; Chuanbo Li
刊名	Journal of Alloys and Compounds
	2018
卷号	750 页码:182-188
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/29294]
专题	半导体研究所_光电子研究发展中心
推荐引用方式 GB/T 7714	Kai Yu ; Fan Yang ; Hui Cong ; Lin Zhou ; Qingyun Liu ; Lichun Zhang ; Buwen Cheng ; Chunlai Xue ; Yuhua Zuo ; Chuanbo Li. Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method[J]. Journal of Alloys and Compounds,2018,750:182-188.
APA	Kai Yu ; Fan Yang ; Hui Cong ; Lin Zhou ; Qingyun Liu ; Lichun Zhang ; Buwen Cheng ; Chunlai Xue ; Yuhua Zuo ; Chuanbo Li.(2018).Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method.Journal of Alloys and Compounds,750,182-188.
MLA	Kai Yu ; Fan Yang ; Hui Cong ; Lin Zhou ; Qingyun Liu ; Lichun Zhang ; Buwen Cheng ; Chunlai Xue ; Yuhua Zuo ; Chuanbo Li."Fabrication of high-hole-mobility germanium-on-insulator wafers through an easy method".Journal of Alloys and Compounds 750(2018):182-188.