| Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process | |
| Shi, Junqin; Chen, Juan; Fang, Liang; Sun, Kun; Sun, Jiapeng; Han, Jing | |
| 刊名 | APPLIED SURFACE SCIENCE
 |
| 2018 | |
| 卷号 | 435页码:983-992 |
| 关键词 | CMP Monocrystalline copper Nanoscratching Water film |
| ISSN号 | 0169-4332 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2917750 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Shi, Junqin,Chen, Juan,Fang, Liang,et al. Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process[J]. APPLIED SURFACE SCIENCE,2018,435:983-992. |
| APA | Shi, Junqin,Chen, Juan,Fang, Liang,Sun, Kun,Sun, Jiapeng,&Han, Jing.(2018).Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process.APPLIED SURFACE SCIENCE,435,983-992. |
| MLA | Shi, Junqin,et al."Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process".APPLIED SURFACE SCIENCE 435(2018):983-992. |
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