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	A Folded Contactless Waveguide Flange for Low Passive-Intermodulation Applications
	Chen, Xiang; Sun, Dongquan; Cui, Wanzhao; He, Yongning
刊名	IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
	2018
卷号	28页码:864-866
关键词	gap waveguide passive intermodulation (PIM) Contactless waveguide flange (CWF)
ISSN号	1531-1309
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2917004
专题	西安交通大学
推荐引用方式 GB/T 7714	Chen, Xiang,Sun, Dongquan,Cui, Wanzhao,et al. A Folded Contactless Waveguide Flange for Low Passive-Intermodulation Applications[J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS,2018,28:864-866.
APA	Chen, Xiang,Sun, Dongquan,Cui, Wanzhao,&He, Yongning.(2018).A Folded Contactless Waveguide Flange for Low Passive-Intermodulation Applications.IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS,28,864-866.
MLA	Chen, Xiang,et al."A Folded Contactless Waveguide Flange for Low Passive-Intermodulation Applications".IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS 28(2018):864-866.

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