A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique

	A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique
	Xu Y(徐杨); Wang YH(王英辉); Liu HG(刘洪刚); Chen DP(陈大鹏)
	2016-10-25
英文摘要	A combined wafer bonding method consist of spot pressing bonding technique and water glass adhesive layer is proposed. The mechanism of water glass bonding is investigated, and the two major factors in this bonding method: surface energy and voids formation has also been
文献子类	会议论文
内容类型	会议论文
源URL	[http://159.226.55.106/handle/172511/16311]
专题	微电子研究所_智能感知研发中心
作者单位	中国科学院微电子研究所
推荐引用方式 GB/T 7714	Xu Y,Wang YH,Liu HG,et al. A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique[C]. 见:.