Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation

doi:10.1016/j.apsusc.2014.07.016

CORC > 近代物理研究所 > 中国科学院近代物理研究所 > 先进核能材料研究室（ADS）

	Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation
	Zhang, Shixu 2,3; Gong, Hengfeng 1,2; Chen, Xuanzhi 2; Li, Gongping 2; Wang, Zhiguang3
刊名	APPLIED SURFACE SCIENCE
	2014-09-30
卷号	314 页码:433-442
关键词	Molecular Dynamics Simulation Low Energy Cluster Deposition Contact Epitaxy Thermal Diffusion Cu Cluster Fe Surface
ISSN号	0169-4332
DOI	10.1016/j.apsusc.2014.07.016
文献子类	Article
英文摘要	The slow deposition of low energy Cu clusters on a Fe (001) surface was investigated by molecular dynamics simulation. A many-body potential based on Finnis-Sinclair model was used to describe the interactions among atoms. Three clusters comprising of 13, 55 and 147 atoms, respectively, were deposited with incident energies ranging from 0.0 to 1.0 eV/atom at various substrate temperatures (0, 300 and 800 K). The rearrangement and the diffusion of cluster can occur, only when the cluster atoms are activated and obtained enough migration energy. The interaction between low energy cluster and substrate can be divided to the landing and the thermal diffusion phases. In the former, the migration energy originates from the latent heat of binding energy for the soft deposition regime and primarily comes from the incident energy of cluster for the energetic cluster deposition regime. In the latter, the thermal vibration would result in some cluster atoms activated again at medium and high substrate temperatures. Also, the effects of incident energy, cluster size and substrate temperature on the interaction potential energy between cluster and substrate, the final deposition morphology of cluster, the spreading index and the structure parameter of cluster are analyzed. (C) 2014 Elsevier B.V. All rights reserved.
资助项目	National Natural Science Foundation of China[91026002]
WOS关键词	CU/FE/CU/SI(111) ULTRATHIN FILMS ; COMPUTER-SIMULATION ; COPPER CLUSTERS ; MAGNETIC-PROPERTIES ; BEAM DEPOSITION ; CONTACT EPITAXY ; THIN-FILMS ; MULTILAYERS ; SUBSTRATE ; GROWTH
WOS研究方向	Chemistry ; Materials Science ; Physics
语种	英语
出版者	ELSEVIER SCIENCE BV
WOS记录号	WOS:000341464100058
内容类型	期刊论文
源URL	[http://119.78.100.186/handle/113462/50017]
专题	近代物理研究所_先进核能材料研究室（ADS）
通讯作者	Li, Gongping
作者单位	1.Chinese Acad Sci, Shanghai Inst Appl Phys, Div Nucl Mat Sci & Engn, Shanghai 207800, Peoples R China 2.Lanzhou Univ, Sch Nucl Sci & Technol, Lanzhou 730000, Peoples R China 3.Chinese Acad Sci, Inst Modern Phys, Lab Adv Nucl Mat, Lanzhou 730000, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Shixu,Gong, Hengfeng,Chen, Xuanzhi,et al. Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation[J]. APPLIED SURFACE SCIENCE,2014,314:433-442.
APA	Zhang, Shixu,Gong, Hengfeng,Chen, Xuanzhi,Li, Gongping,&Wang, Zhiguang.(2014).Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation.APPLIED SURFACE SCIENCE,314,433-442.
MLA	Zhang, Shixu,et al."Low energy Cu clusters slow deposition on a Fe (001) surface investigated by molecular dynamics simulation".APPLIED SURFACE SCIENCE 314(2014):433-442.