| Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes | |
| Zhang, Wenwen; Wu, Zhaoxin; Dong, Jun; Yan, Xuewen; Gao, Wei; Ma, Ruiqiong; Hou, Xun | |
| 刊名 | Physica Status Solidi (A) Applications and Materials Science
 |
| 2018 | |
| 卷号 | 215 |
| 关键词 | Convective heat transfer Coefficient Encapsulation technology Finite element simulations Heat dissipation properties Heat transfer properties Organic light emitting diodes(OLEDs) Temperature reduction Thin film encapsulation |
| ISSN号 | 1862-6300 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2830577 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Zhang, Wenwen,Wu, Zhaoxin,Dong, Jun,et al. Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes[J]. Physica Status Solidi (A) Applications and Materials Science,2018,215. |
| APA | Zhang, Wenwen.,Wu, Zhaoxin.,Dong, Jun.,Yan, Xuewen.,Gao, Wei.,...&Hou, Xun.(2018).Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes.Physica Status Solidi (A) Applications and Materials Science,215. |
| MLA | Zhang, Wenwen,et al."Heat Dissipation Properties of Thin-Film Encapsulation by Insertion of a Metal Thin Film for Organic Light-Emitting Diodes".Physica Status Solidi (A) Applications and Materials Science 215(2018). |
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