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	Discharge and Breakdown Mechanism Transition in the Conditioning Process between Plane-Plane Copper Electrodes in Vacuum
	Li, Shimin; Geng, Yingsan; Liu, Zhiyuan; Wang, Jianhua; Yamano, Yasushi; Okura, Tetsuya; Kyosu, Ryota; Nishiyama, Masashi
刊名	IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
	2019
卷号	26页码:539-546
关键词	particles induced breakdown mechanism transition pulse current discharge field emission induced breakdown vacuum conditioning pulse current induced breakdown
ISSN号	1070-9878
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2826986
专题	西安交通大学
推荐引用方式 GB/T 7714	Li, Shimin,Geng, Yingsan,Liu, Zhiyuan,et al. Discharge and Breakdown Mechanism Transition in the Conditioning Process between Plane-Plane Copper Electrodes in Vacuum[J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION,2019,26:539-546.
APA	Li, Shimin.,Geng, Yingsan.,Liu, Zhiyuan.,Wang, Jianhua.,Yamano, Yasushi.,...&Nishiyama, Masashi.(2019).Discharge and Breakdown Mechanism Transition in the Conditioning Process between Plane-Plane Copper Electrodes in Vacuum.IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION,26,539-546.
MLA	Li, Shimin,et al."Discharge and Breakdown Mechanism Transition in the Conditioning Process between Plane-Plane Copper Electrodes in Vacuum".IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION 26(2019):539-546.

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