Hydrothermal growth and their optoelectronic device application of Cul nanostructure
Li, Zhigang1; Zhang, Lichun1; Wang, Jianbu2; Yang, Lixin1; Xin, Lianjie1; Li, Guang1; Lin, Guochen1; Niu, Songren1; Yan, Jinliang1; Zhao, Fengzhou1
刊名MATERIALS RESEARCH EXPRESS
2019-04
卷号6期号:4
关键词cuprous iodide hydrothermal photodetector nanostructure
ISSN号2053-1591
DOI10.1088/2053-1591/aafbfd
英文摘要Cuprous iodide (Cul) was grown on the Si (100) and Cu films/Si(100) substrate by hydrothermal methods. Different nanostructured CuI have been obtained using hydrothermal reaction and hydrothermal evaporation methods. It has been found that all the nanostructured CuI films have a gamma phase with polycrystalline structure. Having analyzed the photoluminescence (PL) character of nanostructured CuI, the origin of different PL emissions and the different growth mechanisms have been discussed. Then, the photoelectric properties of n-ZnO/p-CuI photodetector with UV light illumination under a different reverse bias have been investigated. Based on the current-voltage curve, the photocurrent to dark current ratio is approximately 80.8 at -3 V.
资助项目Innovation Project of Ludong University[LY2014006]
WOS关键词THIN-FILMS
WOS研究方向Materials Science
语种英语
出版者IOP PUBLISHING LTD
WOS记录号WOS:000456876500003
内容类型期刊论文
源URL[http://ir.fio.com.cn:8080/handle/2SI8HI0U/26381]  
专题自然资源部第一海洋研究所
通讯作者Zhang, Lichun
作者单位1.Ludong Univ, Sch Phys & Optoelect Engn, Yantai 264025, Peoples R China
2.SOA, Inst Oceanog 1, Qingdao 266061, Peoples R China
推荐引用方式
GB/T 7714
Li, Zhigang,Zhang, Lichun,Wang, Jianbu,et al. Hydrothermal growth and their optoelectronic device application of Cul nanostructure[J]. MATERIALS RESEARCH EXPRESS,2019,6(4).
APA Li, Zhigang.,Zhang, Lichun.,Wang, Jianbu.,Yang, Lixin.,Xin, Lianjie.,...&Zhao, Fengzhou.(2019).Hydrothermal growth and their optoelectronic device application of Cul nanostructure.MATERIALS RESEARCH EXPRESS,6(4).
MLA Li, Zhigang,et al."Hydrothermal growth and their optoelectronic device application of Cul nanostructure".MATERIALS RESEARCH EXPRESS 6.4(2019).
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