Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys   on Ni(P)/Au Coated Cu Substrates

doi:10.2320/matertrans.M2009242

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	Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
	Kim, Taeyoung ; Lee, Joonho ; Kim, Yunkyum ; Kim, Jong-Min ; Yuan, Zhangfu
刊名	materials transactions
	2009
关键词	dynamic reactive wetting lead-free solder nickel(-phosphate)/gold coating tin-silver-copper alloy
DOI	10.2320/matertrans.M2009242
英文摘要	In the electronic components and device packaging process, the Cu conductor surface is generally coated with Au and Ni. The Au coating is applied to prevent the oxidation of the Cu surface and enhance the solderability, while the Ni coating is applied as a diffusion barrier between the solder alloy and the Cu substrate. in order to restrict the formation and growth of intermetallic compounds. The dynamic reactive wetting characteristics of Sn-Ag-Cu alloys are related to the properties of the coating materials. In the present study, the dynamic reactive wetting behavior of Sn-Ag-Cu alloys on Cu substrates coated with Ni and Au was firstly investigated on millisecond scale. On the bare Cu surface, the metal droplet rebounded several times due to the poor wettability and started to spread from 1s and became equilibrated by 20 s, whereas on the Ni/Au coated surface. the metal droplet settled down without rebounding because of the good wettability, which caused it to react instantaneously, and became equilibrated by 1s. [doi:10.2320/matertrans.M2009242]; Materials Science, Multidisciplinary; Metallurgy & Metallurgical Engineering; SCI(E); EI; 12; ARTICLE; 11; 2695-2698; 50
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/396227]
专题	工学院
推荐引用方式 GB/T 7714	Kim, Taeyoung,Lee, Joonho,Kim, Yunkyum,et al. Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates[J]. materials transactions,2009.
APA	Kim, Taeyoung,Lee, Joonho,Kim, Yunkyum,Kim, Jong-Min,&Yuan, Zhangfu.(2009).Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates.materials transactions.
MLA	Kim, Taeyoung,et al."Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates".materials transactions (2009).