Influence of Copper Pumping on Integrity and Stress of Through-Silicon   Vias

doi:10.1109/TCPMT.2016.2583508

CORC > 北京大学 > 信息科学技术学院

	Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias
	Su, Fei ; Pan, Xiaoxu ; Huang, Pengfei ; Guan, Yong ; Chen, Jing ; Ma, Shenglin
刊名	IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
	2016
关键词	Copper pumping infrared photoelasticity in situ experimental technique integrity scanning electron microscopy (SEM) stress through-silicon vias (TSVs) CU PROTRUSION FABRICATION
DOI	10.1109/TCPMT.2016.2583508
英文摘要	The influence of copper pumping on through-silicon vias (TSVs) under thermal loading was investigated using an in situ experimental technique. The morphology of the TSV and its evolution with temperature were observed by scanning electric microscopy, and the process of copper pumping and its damage to the integrity of the TSV were recorded. Some new failure modes were found. The maximum height of pumped copper was as high as 5 gm for a single thermal cycle and 25 mu m for multiple cycles. The thermal stress of the TSV and its evolution with temperature were then evaluated using a microinfrared photoelastic system. Full-field and real-time measurements were carried out. It was found that copper pumping at high temperature served to release stress and that this stress-free state of the TSV could be maintained. After cooling or annealing, however, the TSV stress again increased.; National Natural Science Foundation of China [11372024]; SCI(E); EI; ARTICLE; sufei@buaa.edu.cn; pxxstudy@buaa.edu.cn; syl505115@buaa.edu.cn; guanyong@pku.edu.cn; j.chen@pku.edu.cn; 359496892@qq.com; 8; 1221-1225; 6
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/494440]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Su, Fei,Pan, Xiaoxu,Huang, Pengfei,et al. Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias[J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2016.
APA	Su, Fei,Pan, Xiaoxu,Huang, Pengfei,Guan, Yong,Chen, Jing,&Ma, Shenglin.(2016).Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias.IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY.
MLA	Su, Fei,et al."Influence of Copper Pumping on Integrity and Stress of Through-Silicon Vias".IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2016).