QQ客服 官方微博 反馈留言

	A Method to Evaluate the Influence of Different Substrate on Stress Mismatch Induced Deformation in MEMS Accelerometer
	You, Jun ; Tian, Dayu ; He, Chunhua ; Zhao, Qiancheng ; Yang, Zhenchuan ; Zhang, Dacheng ; Yan, Guizhen
	2015
关键词	thermal reliability temperature drift deformation capacitance variation packaging structural design
英文摘要	This paper presents a method to evaluate the influence of stress mismatch between sensor structure and different die-attachment on the thermal stability of accelerometers. The local deformation of MEMS accelerometers under different thermal load and differential die-attachment conditions are investigated. White light interferometer and a home-made heating stage are used to carry out the measurement. Capacitance variations of differential capacitors can be calculated based on the data of the local deformation of MEMS accelerometers. Both the visual evidences and calculated capacitance variations in this work can give clear guidance to optimize both the structural design and packaging conditions.; CPCI-S(ISTP); zqc@pku.edu.cn; 421-425
语种	英语
出处	IEEE 10th International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/450207]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	You, Jun,Tian, Dayu,He, Chunhua,et al. A Method to Evaluate the Influence of Different Substrate on Stress Mismatch Induced Deformation in MEMS Accelerometer. 2015-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。