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	A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer
	You, Jun ; Tian, Dayu ; He, Chunhua ; Zhao, Qiancheng ; Yang, Zhenchuan ; Zhang, Dacheng ; Yan, Guizhen
	2015
英文摘要	This paper presents a method to evaluate the influence of stress mismatch between sensor structure and different die-attachment on the thermal stability of accelerometers. The local deformation of MEMS accelerometers under different thermal load and differential die-attachment conditions are investigated. White light interferometer and a home-made heating stage are used to carry out the measurement. Capacitance variations of differential capacitors can be calculated based on the data of the local deformation of MEMS accelerometers. Both the visual evidences and calculated capacitance variations in this work can give clear guidance to optimize both the structural design and packaging conditions. ? 2015 IEEE.; EI; 421-425
语种	英语
出处	10th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2015
DOI标识	10.1109/NEMS.2015.7147458
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/423572]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	You, Jun,Tian, Dayu,He, Chunhua,et al. A method to evaluate the influence of different substrate on stress mismatch induced deformation in MEMS accelerometer. 2015-01-01.

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