QQ客服 官方微博 反馈留言

	Design and Optimization of a TSV 3D Packaged Pressure Sensor for High Temperature and Dynamic Measurement
	Liu, Zhenhua ; Huang, Xian ; Zhu, Zhiyuan ; Chen, Jing ; Jin, Yufeng
	2012
英文摘要	The piezoresistive pressure sensor has been used to measure the dynamic pressure as well as in high temperature environment. In this paper, a novel TSV 3D packaged pressure sensor is proposed for high temperature environment and dynamic measurement. The pressure sensors and the silicon carrier with TSV are flip chip bonded using Au/Sn eutectic for hermetic encapsulation. In order to reduce the stress generated by the package, two approaches of the bonding ring on the silicon carrier are taken into consideration. Different grooves designed in silicon carrier are simulated. The bonding ring plays a significant role while the shape of grooves in silicon carrier is not critical to the stress.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000319836000015&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Engineering, Electrical & Electronic; EI; CPCI-S(ISTP); 0
语种	英语
DOI标识	10.1109/ICEPT-HDP.2012.6474569
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/405941]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Liu, Zhenhua,Huang, Xian,Zhu, Zhiyuan,et al. Design and Optimization of a TSV 3D Packaged Pressure Sensor for High Temperature and Dynamic Measurement. 2012-01-01.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。