A viable self-aligned bottom-gate MOSFET technology for high density and low voltage SRAM | |
Zhang, Shengdong ; Zhang, Zhikuan ; Lin, Xinnan ; Han, Ruqi ; Ko, Ping K. ; Chan, Mansun | |
2002 | |
英文摘要 | This paper reports the implementation of the bottomgate MOSFET which possesses the following fully-selfaligned structural features: 1) self-aligned source/drain to bottom-gate; 2) self-aligned thick source/drain to thin channel; 3) self-aligned and mask-free lightly-dopeddrain (LDD). The complete self-alignment is realized by combining a conventional ion implantation and a subsequent CMP step. The process is applied to the poly-Si film, which is crystallized from an a-Si film deposited by LPCVD using Metal-Induced Uni-lateral Crystallization (MIUC) technique and is grain-enhanced further in a high temperature annealing step. Deep submicron Fully Self-Aligned Bottom-Gate (FSABG) PMOS transistors with channel length less than 0.5 ??m are fabricated. The measured performance parameters include threshold voltage of -0.43V, subthreshold swing of 113 mV/dec, effective hole mobility of 147 cm2/V-s, off-current of 0.17 pA/??m and on-off current ration of 7.1??108.; EI; 0 |
语种 | 英语 |
DOI标识 | 10.1109/ESSDERC.2002.194969 |
内容类型 | 其他 |
源URL | [http://ir.pku.edu.cn/handle/20.500.11897/330339] |
专题 | 信息科学技术学院 |
推荐引用方式 GB/T 7714 | Zhang, Shengdong,Zhang, Zhikuan,Lin, Xinnan,et al. A viable self-aligned bottom-gate MOSFET technology for high density and low voltage SRAM. 2002-01-01. |
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