Study of the Mechanism of "Smile" in High Power Diode Laser Arrays and Strategies in Improving Near-field Linearity

	Study of the Mechanism of "Smile" in High Power Diode Laser Arrays and Strategies in Improving Near-field Linearity
	Wang JW(Wang Jingwei) ; Yuan ZB(Yuan Zhenbang) ; Kang LJ(Kang Lijun) ; Yang K(Yang Kai) ; Zhang YX(Zhang Yanxin) ; Liu XS(刘兴胜)
	2009
会议名称	2009 59th electronic components and technology conference, ectc 2009
会议日期	2009-05-26
会议地点	san diego, ca, united states
页码	837-842
通讯作者	wang jw
收录类别	EI
会议录	proceedings - electronic components and technology conference
会议录出版者	institute of electrical and electronics engineers inc.
会议录出版地	445 hoes lane / p.o. box 1331, piscataway, nj 08855-1331, united states
学科主题	物理科学和化学
ISSN号	5695503
ISBN号	9781424444762
内容类型	会议论文
源URL	[http://ir.opt.ac.cn/handle/181661/11826]
专题	西安光学精密机械研究所_瞬态光学技术国家重点实验室
推荐引用方式 GB/T 7714	Wang JW,Yuan ZB,Kang LJ,et al. Study of the Mechanism of "Smile" in High Power Diode Laser Arrays and Strategies in Improving Near-field Linearity[C]. 见:2009 59th electronic components and technology conference, ectc 2009. san diego, ca, united states. 2009-05-26.