Morphology and thermal stability of Ti-doped copper nitride films

doi:10.1088/0022-3727/40/11/025

CORC > 化学研究所 > 中国科学院化学研究所

	Morphology and thermal stability of Ti-doped copper nitride films
	Fan, Xiaoyan ; Wu, Zhiguo ; Li, Huajun ; Geng, Baisong ; Li, Chun ; Yan, Pengxun
刊名	JOURNAL OF PHYSICS D-APPLIED PHYSICS
	2007-06-07
卷号	40 期号:11 页码:3430-3435
ISSN号	0022-3727
DOI	10.1088/0022-3727/40/11/025
英文摘要	A weakly Ti-doped copper nitride ( Cu3N) film was prepared by cylindrical magnetron sputtering. The XPS results indicate that Ti atoms do not substitute for the Cu atoms but probably locate at the grain boundaries. The columnar grains size is about half of that of the undoped Cu3N film and the surface is smoother. For weakly Ti-doped Cu3N films, a dense layer appears on top of the columnar crystals. The RMS of the Cu film formed by annealing of the weakly Ti-doped Cu3N film is more than twice larger than that of the film before annealing. Compared with the undoped Cu3N film, it possesses fine thermal stability both in vacuum and in atmosphere.
语种	英语
出版者	IOP PUBLISHING LTD
WOS记录号	WOS:000246577500026
内容类型	期刊论文
源URL	[http://ir.iccas.ac.cn/handle/121111/61355]
专题	中国科学院化学研究所
通讯作者	Yan, Pengxun
作者单位	1.Chinese Acad Sci, Inst Chem & Phys, Key Lab Solid Lubricat, Lanzhou 730000, Peoples R China 2.Lanzhou Univ, Sch Phys Sci & Technol, Lanzhou 730000, Peoples R China
推荐引用方式 GB/T 7714	Fan, Xiaoyan,Wu, Zhiguo,Li, Huajun,et al. Morphology and thermal stability of Ti-doped copper nitride films[J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS,2007,40(11):3430-3435.
APA	Fan, Xiaoyan,Wu, Zhiguo,Li, Huajun,Geng, Baisong,Li, Chun,&Yan, Pengxun.(2007).Morphology and thermal stability of Ti-doped copper nitride films.JOURNAL OF PHYSICS D-APPLIED PHYSICS,40(11),3430-3435.
MLA	Fan, Xiaoyan,et al."Morphology and thermal stability of Ti-doped copper nitride films".JOURNAL OF PHYSICS D-APPLIED PHYSICS 40.11(2007):3430-3435.