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Comparison of growth mechanisms of silicon thin films prepared by hwcvd with pecvd
Zhou, Yuqin; Zhou, Bingqing; Gu, Jinhua; Zhu, Meifang; Liu, Fengzhen
刊名Thin solid films
2008-01-15
卷号516期号:5页码:564-567
关键词Hwcvd Pecvd Silicon thin film Deposition process Growth mechanism Computer simulation
ISSN号0040-6090
DOI10.1016/j.tsf.2007.06.211
通讯作者Zhou, yuqin(yqzhou@gucas.ac.cn)
英文摘要Hot-wire chemical vapor deposition (hwcvd) and plasma-enhanced chemical vapor deposition (pecvd) of si thin films show different growth kinetic processes. according to the fractal analysis, the root-mean-square surface roughness 6 and the film thickness d have the relation of delta similar to d(beta), where beta is the dynamic scaling exponent related to the film growth mechanism. it was found that beta is 0.44 for si films prepared by hwcvd and 0.24 by pecvd. the former refers to a stochastic deposition while the latter corresponds to the finite diffusion of the radicals. monte carlo simulations indicate that the sticking process of growth radicals play an important role in determining the morphology of si films. (c) 2007 published by elsevier b.v.
WOS关键词DEPOSITION
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter
语种英语
出版者ELSEVIER SCIENCE SA
WOS记录号WOS:000252285900019
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/2393198
专题中国科学院大学
通讯作者Zhou, Yuqin
作者单位Grad Univ Chinesee Acad Sci, Coll Phys Sci, Beijing 100049, Peoples R China
推荐引用方式
GB/T 7714
Zhou, Yuqin,Zhou, Bingqing,Gu, Jinhua,et al. Comparison of growth mechanisms of silicon thin films prepared by hwcvd with pecvd[J]. Thin solid films,2008,516(5):564-567.
APA Zhou, Yuqin,Zhou, Bingqing,Gu, Jinhua,Zhu, Meifang,&Liu, Fengzhen.(2008).Comparison of growth mechanisms of silicon thin films prepared by hwcvd with pecvd.Thin solid films,516(5),564-567.
MLA Zhou, Yuqin,et al."Comparison of growth mechanisms of silicon thin films prepared by hwcvd with pecvd".Thin solid films 516.5(2008):564-567.
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