3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway | |
Changzeng Yan; Tianhang Yu; Chao Ji; Xiaoliang Zeng; Jibao Lu; Rong Sun; Ching-Ping Wong | |
刊名 | JOURNAL OF APPLIED POLYMER SCIENCE |
2019 | |
文献子类 | 期刊论文 |
英文摘要 | Heat removal via thermal management materials is attracting more and more attention in the electronic industry. Conventional particle/polymer thermal conductive composites require a high filler loading ratio (>30 vol %), which cause severe thermal interfacial resistance and mechanical issue. In this work, we fabricate tellurium nanowires (NWs)/epoxy nanocomposites via a facile bar coating method. According to Agari model and Maxwell–Eucken model, the as-synthesized ultra-long NWs with high aspect ratio (>100) construct the 3D interconnected thermal conductive network better in resin matrix to facilitate the heat transfer process. The results show that at a low loading ratio of 2.4 vol %, this nanocomposite exhibits the out-of-plane and in-plane thermal conductivity of 0.378 and 1.63 W m−1 K−1, respectively, which is 189 and 715% higher than that of pure epoxy resin. Importantly, good stability, and flexibility of nanocomposites are well maintained. |
URL标识 | 查看原文 |
语种 | 英语 |
内容类型 | 期刊论文 |
源URL | [http://ir.siat.ac.cn:8080/handle/172644/13649] |
专题 | 深圳先进技术研究院_集成所 |
推荐引用方式 GB/T 7714 | Changzeng Yan,Tianhang Yu,Chao Ji,et al. 3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway[J]. JOURNAL OF APPLIED POLYMER SCIENCE,2019. |
APA | Changzeng Yan.,Tianhang Yu.,Chao Ji.,Xiaoliang Zeng.,Jibao Lu.,...&Ching-Ping Wong.(2019).3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway.JOURNAL OF APPLIED POLYMER SCIENCE. |
MLA | Changzeng Yan,et al."3D interconnected high aspect ratio tellurium nanowires in epoxy nanocomposites: serving as thermal conductive expressway".JOURNAL OF APPLIED POLYMER SCIENCE (2019). |
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