Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity.

	Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity.
	Yao, Yimin; Sun, Jiajia; Zeng, Xiaoliang; Sun, Rong; Xu, Jian-Bin; Wong, Ching-Ping
刊名	SMALL
	2018
文献子类	期刊论文
英文摘要	Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through-plane thermal conductivity of these polymercomposites usually yields an undesired value (below 3.0 Wm(-1) K-1). Here, construction of a 3D phonon skeleton is reported composed of stacked boron nitride (BN) platelets reinforced with reduced graphene oxide (rGO) for epoxy composites by the combination of ice-templated and infiltrating methods. At alow filler loading of 13.16 vol%, the resulting 3D BN-rGO/epoxy composites exhibit an ultrahigh through-plane thermal conductivity of 5.05 Wm(-1) K-1 as the best thermal-conduction performance reported so far for BN sheet-based composites. Theoretical models qualitatively demonstrate that this enhancement results from the formation of phonon-matching 3D BN-rGO networks, leading to high rates of phonon transport. The strong potential application for thermalmanagement has been demonstrated by the surface temperature variations of the composites with time during heating and cooling.
URL标识	查看原文
语种	英语
内容类型	期刊论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/13608]
专题	深圳先进技术研究院_集成所
推荐引用方式 GB/T 7714	Yao, Yimin,Sun, Jiajia,Zeng, Xiaoliang,et al. Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity.[J]. SMALL,2018.
APA	Yao, Yimin,Sun, Jiajia,Zeng, Xiaoliang,Sun, Rong,Xu, Jian-Bin,&Wong, Ching-Ping.(2018).Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity..SMALL.
MLA	Yao, Yimin,et al."Construction of 3D Skeleton for Polymer Composites Achieving a High Thermal Conductivity.".SMALL (2018).