The Effect of Functionalized Silver on Properties of Conductive Adhesives | |
Fan, Qiong[1]; Cui, Huiwang[2]; Li, Dongsheng[3]; Hu, Zhili[4]; Yuan, Zhichao[5]; Ye, Lilei[6]; Liu, Johan[7] | |
2011 | |
会议名称 | 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) |
会议日期 | 2011-08-08 |
页码 | 423-425 |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2308684 |
专题 | 上海大学 |
作者单位 | Shanghai Univ, Key Lab Adv Display & Syst Applicat, Minist Educ, Shanghai 200072, Peoples R China. |
推荐引用方式 GB/T 7714 | Fan, Qiong[1],Cui, Huiwang[2],Li, Dongsheng[3],et al. The Effect of Functionalized Silver on Properties of Conductive Adhesives[C]. 见:2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP). 2011-08-08. |
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