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Influence of substrate on electrical conductivity of isotropic conductive adhesive
Hu, Zhili[1]; Du, Wenhui[2]; Yue, Cong[3]; Ye, Lilei[4]; Yuan, Zhichao[5]; Liu, Johan[6]
2011
会议名称2011 International Symposium on Advanced Packaging Materials, APM 2011
会议日期2011-10-25
页码330-335
URL标识查看原文
内容类型会议论文
URI标识http://www.corc.org.cn/handle/1471x/2306744
专题上海大学
作者单位[1]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China |Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Yanchang Road 149, Shanghai 200072, China |SMIT Center, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden [2]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China [3]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China [4]SMIT Ltd. Co., No. 101 of New Science and Technology Building, Science Park, No 149, Yan Chang Road, Shanghai 200072, China [5]SMIT Ltd. Co., No. 101 of New Science and Technology Building, Science Park, No 149, Yan Chang Road, Shanghai 200072, China [6]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, China |SMIT Center, Department of Microtechnology and Nanoscience , Chalmers University of Technology, SE-412 96, G?teborg, Sweden |SHT Smart High Tech. AB, Fysikgr?nd 3, Se 412 96 Gothenburg, Sweden
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GB/T 7714
Hu, Zhili[1],Du, Wenhui[2],Yue, Cong[3],et al. Influence of substrate on electrical conductivity of isotropic conductive adhesive[C]. 见:2011 International Symposium on Advanced Packaging Materials, APM 2011. 2011-10-25.
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