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	Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints
	Bi Wenzhen[1]; Lin Fei[2]; Ju Guokui[3]; Xie Shifang[4]; Wei Xicheng[5]
刊名	RARE METAL MATERIALS AND ENGINEERING
	2012
卷号	41页码:744-748
关键词	low-silver SACBE SAC melting temperature wettability
ISSN号	1002-185X
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2298250
专题	上海大学
作者单位	1.Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China. 2.Jiangxi Acad Sci, Inst Appl Phys, Nanchang 330029, Peoples R China.
推荐引用方式 GB/T 7714	Bi Wenzhen[1],Lin Fei[2],Ju Guokui[3],et al. Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints[J]. RARE METAL MATERIALS AND ENGINEERING,2012,41:744-748.
APA	Bi Wenzhen[1],Lin Fei[2],Ju Guokui[3],Xie Shifang[4],&Wei Xicheng[5].(2012).Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints.RARE METAL MATERIALS AND ENGINEERING,41,744-748.
MLA	Bi Wenzhen[1],et al."Study on Sn-Ag-Cu-Bi-Er Solder with Low-Silver Content and Tensile Properties of the Solder Joints".RARE METAL MATERIALS AND ENGINEERING 41(2012):744-748.

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