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	Evaluation of two flexible substrate technologies by low temperature (200°C) IGZO TFT process
	Chen, Cheng-Chung[1]; Zang, Hao-Chun[2]; Huo, Si-Tao[3]; Ling, Zhi-Hua[4]; Ma, Jun[5]; Li, Xi-Feng[6]; Chen, Long-Long[7]; Zhang, Jian-Hua[8]
	2013
会议名称	20th International Display Workshops 2013, IDW 2013
会议日期	2013-12-03
页码	1566-1567
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2287336
专题	上海大学
作者单位	[1]Tianma Micro-Electronics Group, 889 Huiqing RD., Pudong New District, Shanghai, 201201, China [2]Tianma Micro-Electronics Group, 889 Huiqing RD., Pudong New District, Shanghai, 201201, China [3]Tianma Micro-Electronics Group, 889 Huiqing RD., Pudong New District, Shanghai, 201201, China [4]Tianma Micro-Electronics Group, 889 Huiqing RD., Pudong New District, Shanghai, 201201, China [5]Tianma Micro-Electronics Group, 889 Huiqing RD., Pudong New District, Shanghai, 201201, China [6]Shanghai University, No. 149, Yanchang Rd, Shanghai, China[7]Shanghai University, No. 149, Yanchang Rd, Shanghai, China[8]Shanghai University, No. 149, Yanchang Rd, Shanghai, China
推荐引用方式 GB/T 7714	Chen, Cheng-Chung[1],Zang, Hao-Chun[2],Huo, Si-Tao[3],et al. Evaluation of two flexible substrate technologies by low temperature (200°C) IGZO TFT process[C]. 见:20th International Display Workshops 2013, IDW 2013. 2013-12-03.

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