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	Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing
	Ju, Guokui[1]; Lin, Fei[2]; Bi, Wenzhen[3]; Han, Yongjiu[4]; Wang Junjie[5]; Wei, Xicheng[6]
刊名	SOLDERING & SURFACE MOUNT TECHNOLOGY
	2014
卷号	26页码:173-179
关键词	Intermetallic compounds Microstructure Thermal ageing Filamentous Ag3Sn Sn3.0Ag0.5Cu3.0Bi0.05Cr
ISSN号	0954-0911
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2276796
专题	上海大学
作者单位	1.[1]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 2.[2]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 3.[3]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 4.[4]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 5.[5]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China. 6.[6]Shanghai Univ, Sch Mat Sci & Engn, Shanghai, Peoples R China.
推荐引用方式 GB/T 7714	Ju, Guokui[1],Lin, Fei[2],Bi, Wenzhen[3],et al. Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2014,26:173-179.
APA	Ju, Guokui[1],Lin, Fei[2],Bi, Wenzhen[3],Han, Yongjiu[4],Wang Junjie[5],&Wei, Xicheng[6].(2014).Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing.SOLDERING & SURFACE MOUNT TECHNOLOGY,26,173-179.
MLA	Ju, Guokui[1],et al."Study of IMC at interfaces of Sn3.0Ag0.5Cu3.0Bi0.05Cr/Cu joints during thermal ageing".SOLDERING & SURFACE MOUNT TECHNOLOGY 26(2014):173-179.

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