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	A solder joint structure with vertically aligned carbon nanofibres as reinforcements
	Chen, Si[1]; Jiang, Di[2]; Ye, Lilei[3]; Liu, Johan[4]
	2014
会议名称	5th Electronics System-Integration Technology Conference, ESTC 2014
会议日期	2014-09-16
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2271222
专题	上海大学
作者单位	[1]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, No. 149 Yanchang Road, Shanghai, China |Bionano Systems Laboratory and SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Gothenburg, Sweden [2]Bionano Systems Laboratory and SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Gothenburg, Sweden [3]SHT Smart High-Tech AB, Aschebergsgatan 46, Gothenburg, Sweden[4]SMIT Center, School of Automation and Mechanical Engineering, Shanghai University, No. 149 Yanchang Road, Shanghai, China |Bionano Systems Laboratory and SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Kemiv?gen 9, Gothenburg, Sweden
推荐引用方式 GB/T 7714	Chen, Si[1],Jiang, Di[2],Ye, Lilei[3],et al. A solder joint structure with vertically aligned carbon nanofibres as reinforcements[C]. 见:5th Electronics System-Integration Technology Conference, ESTC 2014. 2014-09-16.

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