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	3D deformation measurement based on colorful electronic speckle pattern interferometry
	Sun, Liuxing[1]; Yu, Yingjie[2]; Zhou, Wenjing[3]
刊名	OPTIK
	2015
卷号	126页码:3998-4003
关键词	Electronic speckle pattern interferometry (ESPI) Wavelet transform Three-dimensional deformation measurement Profile measurement Color CCD
ISSN号	0030-4026
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2265837
专题	上海大学
作者单位	1.[1]Shanghai Univ, Dept Precis Mech Engn, Shanghai 200072, Peoples R China. 2.Shanghai INESA Physicoopt Instrument Co Ltd, Shanghai 201199, Peoples R China. 3.[2]Shanghai Univ, Dept Precis Mech Engn, Shanghai 200072, Peoples R China. 4.[3]Shanghai Univ, Dept Precis Mech Engn, Shanghai 200072, Peoples R China.
推荐引用方式 GB/T 7714	Sun, Liuxing[1],Yu, Yingjie[2],Zhou, Wenjing[3]. 3D deformation measurement based on colorful electronic speckle pattern interferometry[J]. OPTIK,2015,126:3998-4003.
APA	Sun, Liuxing[1],Yu, Yingjie[2],&Zhou, Wenjing[3].(2015).3D deformation measurement based on colorful electronic speckle pattern interferometry.OPTIK,126,3998-4003.
MLA	Sun, Liuxing[1],et al."3D deformation measurement based on colorful electronic speckle pattern interferometry".OPTIK 126(2015):3998-4003.

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