Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch

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	Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch
	Wei YG(魏悦广); Zhao MH(赵满洪); Tang S(唐山)
刊名	Acta Mechanica Sinica
	2002
卷号	18 期号:5 页码:494-505
ISSN号	0567-7718
通讯作者	Wei, YG (reprint author), Chinese Acad Sci, Inst Mech, LNM, Beijing 100080, Peoples R China.
中文摘要	The interface adhesion strength (or interface toughness) of a thin film/substrate system is often assessed by the micro-scratch test. For a brittle film material, the interface adhesion strength is easily obtained through measuring the scratch driving forces. However, to measure the interface adhesion strength (or interface toughness) for a metal thin film material (the ductile material) by the microscratch test is very difficult, because intense plastic deformation is involved and the problem is a three-dimensional elastic-plastic one. In the present research, using a double-cohesive zone model, the failure characteristics of the thin film/substrate system can be described and further simulated. For a steady-state scratching process, a three-dimensional elastic-plastic finite element method based on the double cohesive zone model is developed and adopted, and the steady-state fracture work of the total system is calculated. The parameter relations between the horizontal driving forces (or energy release rate of the scratching process) and the separation strength of thin film/substrate interface, and the material shear strength, as well as the material parameters are developed. Furthermore, a scratch experiment for the Al/Si film/substrate system is carried out and the failure mechanisms are explored. Finally, the prediction results are applied to a scratch experiment for the Pt/NiO material system given in the literature.
学科主题	力学
类目[WOS]	Engineering, Mechanical ; Mechanics
研究领域[WOS]	Engineering ; Mechanics
关键词[WOS]	STRAIN GRADIENT PLASTICITY ; CRACK-GROWTH ; ADHESION ; DELAMINATION ; MECHANICS ; CLEAVAGE ; STRENGTH ; SOLIDS ; MODEL ; FLOW
收录类别	SCI ; EI ; CSCD
原文出处	http://link.springer.com/article/10.1007%2FBF02486574
语种	英语
WOS记录号	WOS:000179015400006
公开日期	2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/17635]
专题	力学研究所_力学所知识产出(1956-2008)
推荐引用方式 GB/T 7714	Wei YG,Zhao MH,Tang S. Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch[J]. Acta Mechanica Sinica,2002,18(5):494-505.
APA	Wei YG,Zhao MH,&Tang S.(2002).Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch.Acta Mechanica Sinica,18(5),494-505.
MLA	Wei YG,et al."Characterization of the Fracture Work for Ductile Film Undergoing the Micro-Scratch".Acta Mechanica Sinica 18.5(2002):494-505.