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	Study on micro-topographical removals of diamond grain and metal bond in dry electro-contact discharge dressing of coarse diamond grinding wheel (EI收录)
	Lu, Y.J.[1]; Xie, J.[1]; Si, X.H.[1]
刊名	International Journal of Machine Tools and Manufacture
	2015
卷号	88页码:118-130
关键词	Carbides Diamonds Grinding (machining) Grinding wheels Metal cutting Metals Spark cutting Surface discharges Surface roughness Topography
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2211216
专题	华南理工大学
作者单位	[1] School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou, China
推荐引用方式 GB/T 7714	Lu, Y.J.[1],Xie, J.[1],Si, X.H.[1]. Study on micro-topographical removals of diamond grain and metal bond in dry electro-contact discharge dressing of coarse diamond grinding wheel (EI收录)[J]. International Journal of Machine Tools and Manufacture,2015,88:118-130.
APA	Lu, Y.J.[1],Xie, J.[1],&Si, X.H.[1].(2015).Study on micro-topographical removals of diamond grain and metal bond in dry electro-contact discharge dressing of coarse diamond grinding wheel (EI收录).International Journal of Machine Tools and Manufacture,88,118-130.
MLA	Lu, Y.J.[1],et al."Study on micro-topographical removals of diamond grain and metal bond in dry electro-contact discharge dressing of coarse diamond grinding wheel (EI收录)".International Journal of Machine Tools and Manufacture 88(2015):118-130.

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