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	Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD
	Zheng, Nanning; Liu, Longjun; Yang, Yang; Wu, Xiulong; Zhao, Xiaoqing; Zhang, Ruizhi; Dai, Liangliang; Wang, Jianxiao; Sun, Hongbin
刊名	IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS
	2019
卷号	Vol.66 No.1页码:226-238
关键词	ReRAM solid state drive reliability endurance bit error rate
ISSN号	1549-8328
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2203894
专题	安徽大学
作者单位	1.Starblaze Technol, Shanghai, Peoples R China 2.Xi An Jiao Tong Univ, Sch Elect Engn, Xian 710049, Shaanxi, Peoples R China 3.Anhui Univ, Sch Elect & Informat Engn, Hefei 230601, Anhui, Peoples R China 4.Xi An Jiao Tong Univ, Sch Elect & Informat Engn, Xian 710049, Shaanxi, Peoples R China 5.Realsil Microelect, Suzhou, Peoples R China
推荐引用方式 GB/T 7714	Zheng, Nanning,Liu, Longjun,Yang, Yang,et al. Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD[J]. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS,2019,Vol.66 No.1:226-238.
APA	Zheng, Nanning.,Liu, Longjun.,Yang, Yang.,Wu, Xiulong.,Zhao, Xiaoqing.,...&Sun, Hongbin.(2019).Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD.IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS,Vol.66 No.1,226-238.
MLA	Zheng, Nanning,et al."Architectural Exploration to Address the Reliability Challenges for ReRAM-Based Buffer in SSD".IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS Vol.66 No.1(2019):226-238.

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