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	Low temperature pressureless sintering of silicon nitride ceramics for circuit substrates in powder electronic devices
	Duan, Yusen[1]; Zhang, Jingxian[2]; Li, Xiaoguang[3]; Shi, Ying[4]; Xie, Jianjun[5]; Jiang, Dongliang[6]
刊名	CERAMICS INTERNATIONAL
	2018
卷号	44页码:4375-4380
关键词	Pressureless sintering Silicon nitride Thermal conductivity Titanium dioxide
ISSN号	0272-8842
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2180410
专题	上海大学
作者单位	1.[1]Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China. 2.Shanghai Univ, Sch Mat Sci & Engn, 99 Shangda Rd, Shanghai 200444, Peoples R China. 3.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China. 4.[2]Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China. 5.[3]Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China. 6.[4]Shanghai Univ, Sch Mat Sci & Engn, 99 Shangda Rd, Shanghai 200444, Peoples R China. 7.[5]Shanghai Univ, Sch Mat Sci & Engn, 99 Shangda Rd, Shanghai 200444, Peoples R China. 8.[6]Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China.
推荐引用方式 GB/T 7714	Duan, Yusen[1],Zhang, Jingxian[2],Li, Xiaoguang[3],et al. Low temperature pressureless sintering of silicon nitride ceramics for circuit substrates in powder electronic devices[J]. CERAMICS INTERNATIONAL,2018,44:4375-4380.
APA	Duan, Yusen[1],Zhang, Jingxian[2],Li, Xiaoguang[3],Shi, Ying[4],Xie, Jianjun[5],&Jiang, Dongliang[6].(2018).Low temperature pressureless sintering of silicon nitride ceramics for circuit substrates in powder electronic devices.CERAMICS INTERNATIONAL,44,4375-4380.
MLA	Duan, Yusen[1],et al."Low temperature pressureless sintering of silicon nitride ceramics for circuit substrates in powder electronic devices".CERAMICS INTERNATIONAL 44(2018):4375-4380.

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