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	Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys.
	Liu, Yong; Huang, Chongxiang; Bei, Hongbin; He, Xiaoyu; Hu, Weiping
刊名	Materials Letters
	2012
卷号	Vol.70页码:26-29
关键词	Nanocrystalline materials Creep Indentation and hardness
ISSN号	0167-577X
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/1993441
专题	四川大学
作者单位	1.Department of Civil Engineering and Mechanics, Sichuan University, Chengdu 610065, PR China 2.Department of Materials Science and Engineering, Oak Ridge National Laboratory, Oak Ridge 37831, USA 3.Institute of Metal Physics and Physical Metallurgy, RWTH Aachen, Aachen 52074, Germany 4.a State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, PR China
推荐引用方式 GB/T 7714	Liu, Yong,Huang, Chongxiang,Bei, Hongbin,et al. Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys.[J]. Materials Letters,2012,Vol.70:26-29.
APA	Liu, Yong,Huang, Chongxiang,Bei, Hongbin,He, Xiaoyu,&Hu, Weiping.(2012).Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys..Materials Letters,Vol.70,26-29.
MLA	Liu, Yong,et al."Room temperature nanoindentation creep of nanocrystalline Cu and Cu alloys.".Materials Letters Vol.70(2012):26-29.

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