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	Electroless plating of copper layer on surfaces of urea–formaldehyde microcapsule particles containing paraffin for low infrared emissivity
	Xi Zhou; Jian Mao; Zhen Qiao
刊名	Particuology
	2016
卷号	Vol.24页码:159-163
关键词	Phase-change material Urea–formaldehyde microcapsules containing paraffin particle Electroless copper plating Low infrared emissivity Enthalpy
ISSN号	1674-2001
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/1910284
专题	四川大学
作者单位	College of Materials Science and Engineering, Sichuan University, No. 24, South Section 1, Yihuan Road, Chengdu 610064, Sichuan, China
推荐引用方式 GB/T 7714	Xi Zhou,Jian Mao,Zhen Qiao. Electroless plating of copper layer on surfaces of urea–formaldehyde microcapsule particles containing paraffin for low infrared emissivity[J]. Particuology,2016,Vol.24:159-163.
APA	Xi Zhou,Jian Mao,&Zhen Qiao.(2016).Electroless plating of copper layer on surfaces of urea–formaldehyde microcapsule particles containing paraffin for low infrared emissivity.Particuology,Vol.24,159-163.
MLA	Xi Zhou,et al."Electroless plating of copper layer on surfaces of urea–formaldehyde microcapsule particles containing paraffin for low infrared emissivity".Particuology Vol.24(2016):159-163.

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