Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding | |
Li Zhongming; Xu Ming; Lu Ai; Zhang Meidong; Huang Rui | |
刊名 | Journal of Applied Polymer Science
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1999 | |
卷号 | Vol.74 NO.7页码:1649-1653 |
关键词 | Epoxy resins Transfer molding Temperature Viscosity Gels Differential scanning calorimetry Curing Heat resistance Thermodynamic stability Composite materials Shear strength Thermooxidation Resin transfer molding Bismaleimide resin system Processing behavi |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/1836542 |
专题 | 四川大学 |
作者单位 | Sichuan Univ, Dept Plast Engn, Chengdu 610065, Sichuan, Peoples R China |
推荐引用方式 GB/T 7714 | Li Zhongming,Xu Ming,Lu Ai,et al. Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding[J]. Journal of Applied Polymer Science,1999,Vol.74 NO.7:1649-1653. |
APA | Li Zhongming,Xu Ming,Lu Ai,Zhang Meidong,&Huang Rui.(1999).Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding.Journal of Applied Polymer Science,Vol.74 NO.7,1649-1653. |
MLA | Li Zhongming,et al."Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding".Journal of Applied Polymer Science Vol.74 NO.7(1999):1649-1653. |
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