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Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding
Li Zhongming; Xu Ming; Lu Ai; Zhang Meidong; Huang Rui
刊名Journal of Applied Polymer Science
1999
卷号Vol.74 NO.7页码:1649-1653
关键词Epoxy resins Transfer molding Temperature Viscosity Gels Differential scanning calorimetry Curing Heat resistance Thermodynamic stability Composite materials Shear strength Thermooxidation Resin transfer molding Bismaleimide resin system Processing behavi
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内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/1836542
专题四川大学
作者单位Sichuan Univ, Dept Plast Engn, Chengdu 610065, Sichuan, Peoples R China
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GB/T 7714
Li Zhongming,Xu Ming,Lu Ai,et al. Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding[J]. Journal of Applied Polymer Science,1999,Vol.74 NO.7:1649-1653.
APA Li Zhongming,Xu Ming,Lu Ai,Zhang Meidong,&Huang Rui.(1999).Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding.Journal of Applied Polymer Science,Vol.74 NO.7,1649-1653.
MLA Li Zhongming,et al."Diallyl bisphenol a ether and diallyl phenyl ether modified bismaleimide resin system for resin transfer molding".Journal of Applied Polymer Science Vol.74 NO.7(1999):1649-1653.
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