Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles

doi:10.12073/j.hjxb.2018390152

	Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles
	Yang, Wanchun 1; Wang, Shuai 2; Zhu, Wenbo 1; Wei, Jun 1; Li, Mingyu 1
刊名	Hanjie Xuebao/Transactions of the China Welding Institution
	2018
卷号	39 期号:6 页码:72-76
ISSN号	0253360X
DOI	10.12073/j.hjxb.2018390152
英文摘要	The Cu nanoparticles (Cu NPs) solder paste was applied to connect high-power semiconductor devices at low temperature. The preparation method of the Cu NPs solder paste included the following steps: First, Cu NPs with an average particle size of 30 nm were synthesized by the modified polyol method. Then, the Cu NPs were dispersed in formic acid to remove the surface oxide of Cu NPs. After that, the Cu NPs were mixed with ethylene glycol to prepare solder paste with a solid content of 70%. The DBC ceramic substrate and the metallized SiC die was connected by sintering at low temperature from 160 to 320 for 5 min, and the assist pressure was 10 MPa. The morphology of the joint was investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The result showed that the connection joints with high shearing strength and conductivity were formed by metallurgical bonding between the sintered Cu NPs layer and Cu pad. Coarse microstructure was formed inside the sintered joint. © 2018, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
出版者	Harbin Research Institute of Welding
内容类型	期刊论文
源URL	[http://ir.sic.ac.cn/handle/331005/25307]
专题	中国科学院上海硅酸盐研究所
作者单位	1.School of materials Science and Engineering, Harbin Institute of Technology, Shenzhen Graduate School, Shenzhen; 518055, China; 2.Shanghai institute of radio equipment, Shanghai; 200090, China
推荐引用方式 GB/T 7714	Yang, Wanchun,Wang, Shuai,Zhu, Wenbo,et al. Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles[J]. Hanjie Xuebao/Transactions of the China Welding Institution,2018,39(6):72-76.
APA	Yang, Wanchun,Wang, Shuai,Zhu, Wenbo,Wei, Jun,&Li, Mingyu.(2018).Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles.Hanjie Xuebao/Transactions of the China Welding Institution,39(6),72-76.
MLA	Yang, Wanchun,et al."Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles".Hanjie Xuebao/Transactions of the China Welding Institution 39.6(2018):72-76.