QQ客服 官方微博 反馈留言

	Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites
	Yun Huang; Xiaoliang Zeng; Rong Sun; Jian-bin Xu; Ching-ping Wong
	2017
会议地点	Harbin, China
英文摘要	To protect electronic components from being affected by heat, and improve the reliability, performance and lifetime of electronic devices, exploitation of thermally conductive polymer composites should be highlighted. Herein, we report on functionalized silicon carbide nanoparticles (SiCNPs) in polymer to fabricate an epoxy/SiCNP composite with a high thermal conductivity of 0.79 W m−1K−1. Some schematic models were employed to demonstrate that the introduced SiCNPs forms thermally conductive networks at the filler loading above the percolation threshold, which is regard as the primary factor of thermal conductivity improvement for the composites. This work paves a way for preparing high thermally conductive polymer composites to address the heat-management issue.
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/11851]
专题	深圳先进技术研究院_集成所
作者单位	2017
推荐引用方式 GB/T 7714	Yun Huang,Xiaoliang Zeng,Rong Sun,et al. Fabrication and Thermal Conduction Mechanism of Epoxy/Modified SiCNP Polymer Composites[C]. 见:. Harbin, China.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。