Electromigration anisotropy introduced by tin orientation in solder joints

CORC > 金属研究所 > 中国科学院金属研究所

	Electromigration anisotropy introduced by tin orientation in solder joints
	Chen, Jian-Qiang ; Liu, Kai-Lang ; Guo, Jing-Dong ; Ma, Hui-Cai ; Wei, Song ; Shang, Jian-Ku
刊名	JOURNAL OF ALLOYS AND COMPOUNDS
	2017-05-05
卷号	703 页码:264-271
关键词	Electromigration Single crystal tin Cu6Sn5 Intermetallic compounds Orientation Diffusion
ISSN号	0925-8388
通讯作者	Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
中文摘要	Single-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved.
学科主题	Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
收录类别	SCI
资助信息	Natural Science Foundation of China [51171191]; National key Scientific Instrument and Equipment development projects of China [2013YQ120355]
语种	英语
公开日期	2017-08-17
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/78146]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,et al. Electromigration anisotropy introduced by tin orientation in solder joints[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2017,703:264-271.
APA	Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,Ma, Hui-Cai,Wei, Song,&Shang, Jian-Ku.(2017).Electromigration anisotropy introduced by tin orientation in solder joints.JOURNAL OF ALLOYS AND COMPOUNDS,703,264-271.
MLA	Chen, Jian-Qiang,et al."Electromigration anisotropy introduced by tin orientation in solder joints".JOURNAL OF ALLOYS AND COMPOUNDS 703(2017):264-271.