| Packaging of high power semiconductor lasers | |
| Liu, Xingsheng1; Zhao, Wei2; Xiong, Lingling2; Liu, Hui2 | |
| 2015 | |
| 出版者 | springer |
| 出版地 | new york |
| 英文摘要 | this book introduces high power semiconductor laser packaging design. the challenges of the design and various packaging and testing techniques are detailed by the authors. new technologies and current applications are described in detail. © springer science+business media new york 2015. |
| 页数 | 415 |
| ISBN | 9781461492627 |
| 语种 | 英语 |
| 内容类型 | 专著 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/29089]  |
| 专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 西安光学精密机械研究所_炬光科技有限公司 |
| 作者单位 | 1.Focuslight Technologies Co., Ltd, Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China 2.Xi’an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Shaanxi, China |
| 推荐引用方式 GB/T 7714 | Liu, Xingsheng,Zhao, Wei,Xiong, Lingling,et al. Packaging of high power semiconductor lasers[M]. new york:springer,2015. |
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