| 微型电容式压力传感器硅基薄膜的设计与制备; Design and Fabrication of a Silicon Membrane for Micro Capacitive Pressure Sensors | |
| 陶也 ; 曾毅波 ; 刘畅 ; 林杰 ; 郭航 | |
| 2013-09-28 | |
| 关键词 | 微机电系统 电容式压力传感器 硅薄膜 超声腐蚀 化学机械抛光 MEMS capacitive pressure sensor silicon membrane utrlasonic corrosion chemical mechanical polishing(CMP) |
| 英文摘要 | 获得均匀、平整的硅基薄膜是制备出高灵敏度的微型电容式压力传感器的关键步骤.首先在理论分析的基础上,确定了微型电容式压力传感器的基本参数,而后在制备中,发展了一种新型的硅基薄膜制作方法,即利用硅-玻璃键合工艺,结合浓kOH溶液超声腐蚀与化学机械抛光的方法,得到了厚度为10μM的均匀、平整的硅基薄膜,为制备微型压力传感器奠定了工艺基础,也可用于其他微机电系统(MEMS)压力传感器.; A smooth silicon membrane with uniform thickness is a key factor for a high-sensitivity MEMS-based capacitive pressure sensor.Based on the theoretical analysis,the geometry parameters of the micro capacitive pressure sensors are determined.During the manufacturing,a new method of fabricating silicon membrane is proposed that involves silicon-glass bonding,chemical mechanical polishing(CMP)and ultrasonic corrosion in KOH aqua and process technique are discussed in detail.With this method,a silicon membrane with uniform thickness of 10μm is obtained.The silicon membrane fabrication technique developed in this paper can also be used in other MEMS-based capacitive sensors.; 航空科学基金项目(2008ZH68002) |
| 语种 | zh_CN |
| 内容类型 | 期刊论文 |
| 源URL | [http://dspace.xmu.edu.cn/handle/2288/105716]  |
| 专题 | 航空航天－已发表论文 |
| 推荐引用方式 GB/T 7714 | 陶也,曾毅波,刘畅,等. 微型电容式压力传感器硅基薄膜的设计与制备, Design and Fabrication of a Silicon Membrane for Micro Capacitive Pressure Sensors[J],2013. |
| APA | 陶也,曾毅波,刘畅,林杰,&郭航.(2013).微型电容式压力传感器硅基薄膜的设计与制备.. |
| MLA | 陶也,et al."微型电容式压力传感器硅基薄膜的设计与制备".(2013). |
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