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	Thermal conductivity and microhardness of MWCNTs/copper nanocomposites
	Xu, L.S. ; Chen, X.H. ; Liu, X.J. ; Yu, Y. ; Wu, Y.R. ; Liu XJ(刘兴军)
	2011
关键词	Copper Dispersions Electronics packaging Hot pressing Hot rolling Microhardness Multiwalled carbon nanotubes (MWCN) Nanocomposites Packaging Reinforced plastics Thermal conductivity Vacuum applications
英文摘要	Conference Name:2011 International Symposium on Advanced Packaging Materials, APM 2011. Conference Address: Xiamen, China. Time:October 25, 2011 - October 28, 2011.; The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix. ? 2011 IEEE.
语种	英语
出处	http://dx.doi.org/10.1109/ISAPM.2011.6105686
出版者	IEEE Computer Society
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/85152]
专题	材料学院－会议论文
推荐引用方式 GB/T 7714	Xu, L.S.,Chen, X.H.,Liu, X.J.,et al. Thermal conductivity and microhardness of MWCNTs/copper nanocomposites. 2011-01-01.

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