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	Development of a Two-dimensional Ultrasonic Vibration Assisted Machining Technology with Tool Vibration
	Wang, Z. Z. ; Guo, Y. B. ; Wu, Y. B. ; Guo YB(郭隐彪)
	2011
英文摘要	Conference Name:16th Conference of Abrasive Technology in China. Conference Address: Urumqi, PEOPLES R CHINA. Time:AUG 07-10, 2011.; As the reliable technology, ultrasonic assisted machining is widely used for brittle materials. This paper provides a two-dimensional(2D) ultrasonic vibration assisted machining technology with tool vibration using elliptical vibrator with longitudinal mode and bending mode, and set up the experiment device. Si wafer is taken as the workpiece, and single point cutting experiments for micro groove are investigated. For the further application, the ultrasonic assisted polishing experiment with wheel block is executed. Experimental results indicate that ultrasonic assisted cutting with tool vibration can improve the cutting performance and enhance the ductile removal. And the ultrasonic assisted polishing with whetstone piece makes the better surface roughness and higher material removal rate.
语种	英语
出处	http://dx.doi.org/10.4028/www.scientific.net/KEM.487.419
出版者	KEY ENG MATER
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/86024]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Wang, Z. Z.,Guo, Y. B.,Wu, Y. B.,et al. Development of a Two-dimensional Ultrasonic Vibration Assisted Machining Technology with Tool Vibration. 2011-01-01.

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