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	Development of an efficient thermal transfer structure in rapid heat cycle molding
	Fan Zengwei ; Ge Xiaohong ; Huang Hongwu ; Li Hui ; Ge XH(葛晓宏)
	2011
关键词	SIMULATION SYSTEMS
英文摘要	Conference Name:International Conference on Materials Science and Technology. Conference Address: Jeju Island, SOUTH KOREA. Time:DEC 27-28, 2010.; The efficiency of the orientation thermal transfer is the key in rapid heat cycle molding (RHCM) technology, because it significantly affects the energy consumption, productivity and the quality of the final polymer parts. Therefore, the thermal response of the integral mold insert in SRHCM process has been simulated by ANSYS, and a novel thermal transfer structure in the form of combined mold insert with insulation layer has been developed to reduce the energy waste. The milled U-grooves act as thermal transfer channels in this structure, which can be manufactured conveniently to obtain high surface quality easily. The simulation results show that the novel structure can save energy consumption evidently, that the heating time is reduced by 35.7 percent, and that the cooling time is reduced by 24.9 percent compared with the unmodified one.
语种	英语
出处	http://dx.doi.org/10.4028/www.scientific.net/AMR.181-182.1025
出版者	ADV MATER RES-SWITZ
内容类型	其他
源URL	[http://dspace.xmu.edu.cn/handle/2288/86001]
专题	物理技术－会议论文
推荐引用方式 GB/T 7714	Fan Zengwei,Ge Xiaohong,Huang Hongwu,et al. Development of an efficient thermal transfer structure in rapid heat cycle molding. 2011-01-01.

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