Thermoplastic shear localisation in titanium alloys during dynamic deformation
Xu YB(徐永波); Liu L; Yu JQ; Shen LT(沈乐天); Bai YL(白以龙)
刊名Materials Science and Technology
2000
卷号16期号:6页码:609-611
ISSN号0267-0836
通讯作者Xu, YB (reprint author), Chinese Acad Sci, Met Res Inst, State Key Lab Fatigue & Fracture Mat, Shenyang 110015, Peoples R China.
中文摘要Cylindrical specimens (4 mm diameter and 4 mm height) of titanium alloy bar were given various heat treatments to provide a wide range of microstructures and mechanical parameters. These specimens were then subjected to high plastic strain at a large strain rate (103 s-1 ) during dynamic compression by a split Hopkinson bar at ambient temperature. The microstructures of the localised shear bands were examined by optical and transmission electron microscopy. The results show that there are two types of localised shear bands: deformed and white shear bands. A detailed observation reveals that there is no difference in the nature of the deformed and white shear bands, but they occur at different stages of localised deformation. It is found that there is a burst of strain, corresponding to a critical strain rate at which the white shear band occurs and no phase transformation occurs in the shear bands.
学科主题力学
类目[WOS]Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
研究领域[WOS]Materials Science ; Metallurgy & Metallurgical Engineering
关键词[WOS]INSTABILITY
收录类别SCI
语种英语
WOS记录号WOS:000087866700004
公开日期2007-06-15 ; 2007-12-05 ; 2009-06-23
内容类型期刊论文
源URL[http://dspace.imech.ac.cn/handle/311007/16708]  
专题力学研究所_力学所知识产出(1956-2008)
推荐引用方式
GB/T 7714
Xu YB,Liu L,Yu JQ,et al. Thermoplastic shear localisation in titanium alloys during dynamic deformation[J]. Materials Science and Technology,2000,16(6):609-611.
APA 徐永波,Liu L,Yu JQ,沈乐天,&白以龙.(2000).Thermoplastic shear localisation in titanium alloys during dynamic deformation.Materials Science and Technology,16(6),609-611.
MLA 徐永波,et al."Thermoplastic shear localisation in titanium alloys during dynamic deformation".Materials Science and Technology 16.6(2000):609-611.
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