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	Cu在Ni-Mo-P镀层的低温扩散行为
	王梅玲 ; 杨志刚 ; 张弛 ; WANG Mei-ling ; YANG Zhi-gang ; ZHANG Chi
	2016-03-30 ; 2016-03-30
关键词	Cu扩散 非晶 X射线衍射 Cu diffusion amorphous X-ray diffraction TG174.4
其他题名	Diffusion behavior of Cu in Ni-Mo-P coating at low-temperature
中文摘要	通过化学镀的方法在Cu基底上制备了不同晶态的Ni-Mo-P镀层,对Ni-1.0 at%Mo-17.0 at%合金镀层进行了200~600℃的真空热处理后,利用X射线荧光光谱仪、X射线衍射仪、俄歇电子能谱仪、能量散射谱仪对样品的厚度、成分、物相结构进行了表征与分析。结果表明,随着P含量的增加,合金镀层的晶态由结晶到混晶、非晶转变。随着热处理温度的增加,镀层本身结晶性提高,Cu原子扩散到镀层中,从而影响镀层的晶态。通过计算可得,400和500℃时,Cu扩散量为4.14 at%、6.14 at%。Cu在Ni-1.0 at%Mo-17.0 at%合金镀层中的扩散激活能为1.11 eV。; The Ni-Mo-P alloy coatings were fabricated by electroless deposition with different composition. The composition and thickness of Ni-Mo-P alloy coatings were tested by X-ray fluorescence spectrometer. The crystalline states,depth profiles of Ni-1. 0 at% Mo-17at% coatings after different annealing temperatures for 30 min were investigated by means of X-ray diffraction,Auger electro spectrometer, respectively. The results show the crystallized Ni-Mo-P coatings became to amorphous one with increasing of P content. The diffusion quantity of Cu into Ni-Mo-P coatings at 400 ℃,500 ℃ are 4. 14 at%,6. 14 at% calculated through XRD patterns. The activation energy of diffusion for Cu in Ni-1. 0 at% Mo-17 at% is 1. 5 eV.
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://ir.lib.tsinghua.edu.cn/ir/item.do?handle=123456789/141686]
专题	清华大学
推荐引用方式 GB/T 7714	王梅玲,杨志刚,张弛,等. Cu在Ni-Mo-P镀层的低温扩散行为[J],2016, 2016.
APA	王梅玲,杨志刚,张弛,WANG Mei-ling,YANG Zhi-gang,&ZHANG Chi.(2016).Cu在Ni-Mo-P镀层的低温扩散行为..
MLA	王梅玲,et al."Cu在Ni-Mo-P镀层的低温扩散行为".(2016).

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