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	Development of reworkable underfill materials for flip chip
	Yu Kun ; Liang Tongxiang ; Guo Wenli
	2010-10-12 ; 2010-10-12
关键词	Practical/ circuit reliability electronics packaging flip-chip devices/ reworkable underfill material flip-chip cycle fatigue life packaging process electronic packaging/ B0170J Product packaging B0170N Reliability
中文摘要	Flip-chip onto organic substrate becomes a mature process with a stable structure. Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process. The issues of lack of reworkability limiting the final yield of this technology and leading to the increase of cost are analyzed. It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill, so it is very important for electronic packaging. Reworkable underfill technology is reviewed, target performances and recent development of reworkable underfill materials are described.
语种	中文
出版者	Editorial Board of Semiconductor Technology ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/79274]
专题	清华大学
推荐引用方式 GB/T 7714	Yu Kun,Liang Tongxiang,Guo Wenli. Development of reworkable underfill materials for flip chip[J],2010, 2010.
APA	Yu Kun,Liang Tongxiang,&Guo Wenli.(2010).Development of reworkable underfill materials for flip chip..
MLA	Yu Kun,et al."Development of reworkable underfill materials for flip chip".(2010).

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