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	Fracture mechanics analysis on Smart-Cut((R)) technology. Part 1: Effects of stiffening wafer and defect interaction
	Gu, Bin ; Liu, Hongyuan ; Mai, Yiu-Wing ; Feng, Xi Qiao ; Yu, Shou Wen
	2010-10-12 ; 2010-10-12
关键词	Smart-Cut technology Silicon-on-insulator wafer Crack growth Fracture mechanics Stress intensity factor DISSIMILAR PIEZOELECTRIC LAYERS INSULATOR MATERIAL TECHNOLOGY H-IMPLANTED SI ION-CUT TRANSIENT-RESPONSE SILICON TEMPERATURE EXFOLIATION CRACK INTERFACE Engineering, Mechanical Mechanics
中文摘要	In the present paper, continuum fracture mechanics is used to analyze the Smart-Cut process, a recently established ion cut technology which enables highly efficient fabrication of various silicon-on-insulator (SOI) wafers of high uniformity in thickness. Using integral transform and Cauchy singular integral equation methods, the mode-I and mode-II stress intensity factors, energy release rate, and crack opening displacements are derived in order to examine several important fracture mechanisms involved in the Smart-Cut process. The effects of defect interaction and stiffening wafer on defect growth are investigated. The numerical results indicate that a stiffener/handle wafer can effectively prevent the donor wafer from blistering and exfoliation, but it slows down the defect growth by decreasing the magnitudes of SIF's. Defect interaction also plays an important role in the splitting process of SOI wafers, but its contribution depends strongly on the size, interval and internal pressure of defects. Finally, an analytical formula is derived to estimate the implantation dose required for splitting a SOI wafer.
语种	英语 ; 英语
出版者	SPRINGER HEIDELBERG ; HEIDELBERG ; TIERGARTENSTRASSE 17, D-69121 HEIDELBERG, GERMANY
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/79188]
专题	清华大学
推荐引用方式 GB/T 7714	Gu, Bin,Liu, Hongyuan,Mai, Yiu-Wing,et al. Fracture mechanics analysis on Smart-Cut((R)) technology. Part 1: Effects of stiffening wafer and defect interaction[J],2010, 2010.
APA	Gu, Bin,Liu, Hongyuan,Mai, Yiu-Wing,Feng, Xi Qiao,&Yu, Shou Wen.(2010).Fracture mechanics analysis on Smart-Cut((R)) technology. Part 1: Effects of stiffening wafer and defect interaction..
MLA	Gu, Bin,et al."Fracture mechanics analysis on Smart-Cut((R)) technology. Part 1: Effects of stiffening wafer and defect interaction".(2010).

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