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	Joint strength with soldering of Al/sub 2/O/sub 3/ ceramics after Ni-P chemical plating
	Zou Guisheng ; Wu Aiping ; Zhang Deku ; Meng Fanming ; Bai Hailin ; Zhang Yongqing ; Li Yi ; Wu Shijie ; Gu Zhaozhan
	2010-05-10 ; 2010-05-10
关键词	Practical Experimental/ aluminium compounds brazing ceramics electroplated coatings fracture shear strength soldering/ ceramics chemical plating brazing joint fracture joint strength soldering uniform alloy coatings Cu metal electroplated active colophony shear strength heat treatment ceramic surface roughness adhesion 170 C Al/sub 2/O/sub 3/ Ni-P Cu Sn Pb/ A8115L Deposition from liquid phases (melts and solutions) A8160D Surface treatment and degradation of ceramics and refractories A8190 Other topics in materials science A8140N Fatigue, embrittlement, and fracture/ temperature 4.43E+02 K/ Al2O3/bin Al2/bin Al/bin O3/bin O/bin NiP/bin Ni/bin P/bin Cu/el Sn/el Pb/el
中文摘要	Ni-P alloy was chemically plated on Al/sub 2/O/sub 3/ ceramics to produce uniform alloy coatings at temperatures below 70 degrees C. Cu metal was electroplated onto the Ni-P coating to facilitate the soldering and shorten the chemical plating time. Then, the electroplated ceramic specimens were soldered with 60 wt.% Sn-40 wt.% Pb solder in active colophony. The highest shear strength was acquired after the heat treatment at 170 degrees C for 15 m. The joint fractures mostly propagated along the interface between the ceramics and the Ni-P coating, with some fracture in both the ceramics and the Ni-P coating near the interface and some along the interface between the Cu and Ni-P coatings. The results show that ceramic surface roughness and the chemical plating parameters influence the coating quality, and that suitable heat treatment before the soldering also improves the adhesion between the ceramics and Ni-P coatings, thus strengthening the joints.
语种	英语 ; 英语
出版者	Editorial Board of J. of Tsinghua University ; China
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/24337]
专题	清华大学
推荐引用方式 GB/T 7714	Zou Guisheng,Wu Aiping,Zhang Deku,et al. Joint strength with soldering of Al/sub 2/O/sub 3/ ceramics after Ni-P chemical plating[J],2010, 2010.
APA	Zou Guisheng.,Wu Aiping.,Zhang Deku.,Meng Fanming.,Bai Hailin.,...&Gu Zhaozhan.(2010).Joint strength with soldering of Al/sub 2/O/sub 3/ ceramics after Ni-P chemical plating..
MLA	Zou Guisheng,et al."Joint strength with soldering of Al/sub 2/O/sub 3/ ceramics after Ni-P chemical plating".(2010).

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