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	Analysis and application for a new type of optical fiber interferometer with three-beam system
	Kai Yin ; Liwei Wang ; Tianhuai Ding ; Min Zhang ; Yanbiao Liao
	2010-05-10 ; 2010-05-10
会议名称	Proceedings of the SPIE - The International Society for Optical Engineering ; Fundamental Problems of Optoelectronics and Microelectronics III ; Harbin, China ; INSPEC
关键词	Practical Theoretical or Mathematical/ fibre optic sensors hydrophones light interferometers phase noise/ optical fiber interferometer three-beam system intensity noises phase noise optical fiber sensor optical fiber hydrophone array/ A4281P Fibre optic sensors fibre gyros A0760L Optical interferometry B7230E Fibre optic sensors B4125 Fibre optics
中文摘要	In this work, a study of a new type of optical fiber interferometer with three-beam system has been carried out. Some analyses of the performances of the interferometer have been considered and reported upon. A theoretical model of the optical fiber interferometer and demonstration that such system could be constructed by optical fiber structures are presented. To achieve the goal which ensures higher performance and stability of the interferometer the simulations for intensity noises, phase noise in the interference path and phase shift noise of the certain three-beam optical fiber interferometer have been carried out. The results indicate that the 3 * 3 coupler is key factor. The optical fiber interferometer could be used to constitute an optical fiber sensor such as optical fiber hydrophones array. Other applications of optical fiber sensor with the three-beam interferometer also have been discussed.
会议录出版者	SPIE - The International Society for Optical Engineering ; USA
语种	英语 ; 英语
内容类型	会议论文
源URL	[http://hdl.handle.net/123456789/19272]
专题	清华大学
推荐引用方式 GB/T 7714	Kai Yin,Liwei Wang,Tianhuai Ding,et al. Analysis and application for a new type of optical fiber interferometer with three-beam system[C]. 见:Proceedings of the SPIE - The International Society for Optical Engineering, Fundamental Problems of Optoelectronics and Microelectronics III, Harbin, China, INSPEC.

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