The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects

CORC > 上海硅酸盐研究所 > 中国科学院上海硅酸盐研究所 > 结构陶瓷与复合材料工程研究中心 > 期刊论文

	The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects
	Qi, Qian 1,2; Liu, Yan 1; Zhang, Hui 1; Zhao, Jing 1; Gai, Linlin 1,2; Huang, Zhengren 1
刊名	ADVANCED ENGINEERING MATERIALS
	2016-08-01
卷号	18 期号:8 页码:1504-1510
英文摘要	The TiC/Ni-Cr composites are promising candidates for IT-SOFC interconnects. In this paper, the TiC/Ni-Cr composites are fabricated by pressureless infiltration, and in order to increase the contiguity of TiC, the partial in situ method and isothermal heat treatment are used. The results show that with the increase of in situ TiC from 10 (TG1) to 20 wt% (TG2), the thermal expansion (CTE) decreases by 0.1 x 10(-6) degrees C-1, and electrical resistivity (sigma) decreases from 5.23 x 10(-3) to 1.59 x 10(-3) Omega cm and from 2.23 x 10(-3) to 0.93 x 10(-3) Omega cm with isothermal heat treatment. By contrast, the isothermal heat treatment at 1 300 degrees C for 20 min can nearly doubly increase the contiguity of TiC. The CTE shows decrease by 0.4 x 10(-6) degrees C-1, and (s decreases from 5.23 x 10(-3) to 2.23 x 10(-3) Omega cm in TG1 and from 1.59 x 10(-3) to 0.93 x 10(-3) Omega cm in TG2.
WOS标题词	Science & Technology ; Technology
类目[WOS]	Materials Science, Multidisciplinary
研究领域[WOS]	Materials Science
关键词[WOS]	ALUMINUM-MATRIX COMPOSITES ; SIC PARTICLES ; MICROSTRUCTURE ; BEHAVIOR ; CONDUCTIVITY
收录类别	SCI
语种	英语
WOS记录号	WOS:000382984300022
内容类型	期刊论文
源URL	[http://ir.sic.ac.cn/handle/331005/22832]
专题	上海硅酸盐研究所_结构陶瓷与复合材料工程研究中心_期刊论文
作者单位	1.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China
推荐引用方式 GB/T 7714	Qi, Qian,Liu, Yan,Zhang, Hui,et al. The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects[J]. ADVANCED ENGINEERING MATERIALS,2016,18(8):1504-1510.
APA	Qi, Qian,Liu, Yan,Zhang, Hui,Zhao, Jing,Gai, Linlin,&Huang, Zhengren.(2016).The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects.ADVANCED ENGINEERING MATERIALS,18(8),1504-1510.
MLA	Qi, Qian,et al."The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects".ADVANCED ENGINEERING MATERIALS 18.8(2016):1504-1510.