Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics

	Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics
	Jing Hongqi ; Zhong Li ; Ni Yuxi ; Zhang Junjie ; Liu Suping ; Ma Xiaoyu
刊名	journal of semiconductors
	2016
卷号	36 期号:10 页码:102006
学科主题	半导体器件
收录类别	SCI
公开日期	2017-03-16
内容类型	期刊论文
源URL	[http://ir.semi.ac.cn/handle/172111/27944]
专题	半导体研究所_半导体集成技术工程研究中心
推荐引用方式 GB/T 7714	Jing Hongqi,Zhong Li,Ni Yuxi,et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. journal of semiconductors,2016,36(10):102006.
APA	Jing Hongqi,Zhong Li,Ni Yuxi,Zhang Junjie,Liu Suping,&Ma Xiaoyu.(2016).Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics.journal of semiconductors,36(10),102006.
MLA	Jing Hongqi,et al."Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics".journal of semiconductors 36.10(2016):102006.