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	A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics
	Zhang Yu; Zhu Pengli; Sun Rong; Wong Chingping
	2013
会议名称	2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013
会议地点	Dalian, China
英文摘要	Well-dispersed stable copper based conductive ink was prepared in which the copper nanoparticles possess a more excellent dispersive, monodispersed size distribution and strong anti-oxidation. Conductive patterns were manufactured with the conductive ink via silk-screen printing onto the flexible substrate. The resistivity of the conductive films was 18.9 μΩ-cm after heat-treatment at 250 °C for 30 min under inert atmosphere.
收录类别	EI
语种	英语
内容类型	会议论文
源URL	[http://ir.siat.ac.cn:8080/handle/172644/4587]
专题	深圳先进技术研究院_集成所
作者单位	2013
推荐引用方式 GB/T 7714	Zhang Yu,Zhu Pengli,Sun Rong,et al. A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics[C]. 见:2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013. Dalian, China.

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